Coskun, E.Gullu, H. H.Candan, I.Bayrakli, O.Parlak, M.Ercelebi, C.2025-01-272025-01-2720151369-80011873-4081https://doi.org/10.1016/j.mssp.2015.02.043https://hdl.handle.net/20.500.12428/27391In this work, p-(Ag-Ga-In-Te) polycrystalline thin films were deposited on soda-lime glass and n-type Si substrates by e-beam evaporation of AgGa0.5In0.5Te2 crystalline powder and the thermal evaporation of Ag powder, sequentially in the same chamber. The carrier concentration and mobility of the Ag-Ga-In-Te (AGIT) film were determined as 5.82 x 10(15) cm(-3) and 13.81 cm(2)/(V s) as a result of Hall Effect measurement. The optical analysis indicated that the band gap values of the samples were around 1.58 eV. The structural analysis was carried out by means of X-ray diffraction. Current-Voltage (I-V) measurements depending on the sample temperature were performed to investigate the device characteristics and the dominant conduction mechanism in an In/p-AGIT/n-Si/Ag structure. The series and shunt resistances were calculated by the help of parasitic resistance analysis as 5.73 and 1.57 x 10(4) Omega cm(2), respectively at room temperature. The ideality factors and barrier heights were evaluated as a function of sample temperature. In the low bias region, the thermionic emission together with the generation-recombination mechanism was investigated as the dominant transport mechanism; however, in the high bias region, space charge limited current was analyzed as the other effective mechanism in the carrier conduction. The built-in potential of the device was also determined by the help of capacitance-voltage measurements. (C) 2015 Elsevier Ltd. All rights reserved.eninfo:eu-repo/semantics/closedAccessThin filmsHeterojunctionsDepositionElectrical transportThermal analysisDevice behavior of an In/p-Ag(Ga,In)Te2/n-Si/Ag heterojunction diodeArticle3413814510.1016/j.mssp.2015.02.043Q1WOS:0003538445000212-s2.0-84923926879Q1